According to BlockBeats, on August 6, Alphabet, Google's parent company, attracted approximately $115 billion in subscription demand for its massive bond issuance.

As previously reported, Alphabet is preparing to issue a new round of US corporate bonds, planning to raise up to $25 billion. The bonds will be divided into up to 10 tranches with maturities ranging from 2 to 40 years; the final size has not yet been determined. This money will supplement Google's funding to continue expanding its AI infrastructure.

According to BlockBeats, on August 6, Musk posted that he roughly estimates that about 25% of TeraFab's AI computing power output will be used for Tesla's Optimus and about 75% will be used for AI spacecraft.

As previously reported, Tesla announced plans to launch Terafab in Texas, aiming to achieve over 1 terawatt of computing power annually.

According to BlockBeats, on August 6th, Trade.xyz announced that it has launched trading of Roundhill Photonics & Optics ETF (LYTE) contracts, supporting leverage up to 10x.

BlockBeats reported on August 6th that Tesla (TSLA) announced earlier this year the launch of Project Terafab—the world's largest chip manufacturing initiative, integrating logic chips, memory chips, and advanced packaging technologies within a single facility. In April, Tesla broke ground on a new R&D wafer fab at its Texas Gigafactory North Campus, the precursor to Terafab. Today, we are officially announcing that Terafab will be located in Grimes County, Texas. This facility will be an advanced semiconductor wafer fab designed to bridge the huge gap between current global chip supply capacity and future computing demands. SpaceX and Tesla's combined chip demand is projected to exceed 1 terawatt (TW) of computing power, far exceeding current global supply capacity. We are highly grateful to existing chip suppliers and encourage them to expand capacity where possible, but the widening gap between future supply and demand is the core reason for the existence of Project Terafab.

Terafab's goal is to manufacture new computing power at an unprecedented scale and speed. The project plans to build a vertically integrated factory with a manufacturing area exceeding 100 million square feet. The facility will encompass the manufacturing, packaging, and testing of advanced logic and memory chips. Centralizing these processes in one location will facilitate rapid iterative improvements and accelerate the deployment of new computing power. (Jinshi)